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Heating equipment series tailored for research scenarios
KHL-P500 Laser Spot Heating System
Product Overview
The KHL-P500 Laser Spot Heating System is a precision thermal loading solution designed for material heat treatment, localized rapid heating, high-temperature performance testing, and research experiments. Utilizing a high-power semiconductor laser as the heat source, the system employs optical beam shaping and focusing to deliver precise energy to millimeter-scale areas, enabling non-contact, high-speed, and high-energy-density localized heating. The equipment supports multiple energy distribution modes, including flat-top and Gaussian beams, and can be configured based on material type, process requirements, and temperature field specifications. It is ideal for thermal processing and testing applications across metals, ceramics, composites, and electronic materials.
Product Positioning
Millimeter-scale laser spot heating
High-power semiconductor lasers, after optical shaping and focusing, deliver energy precisely to millimeter-scale regions for non-contact, high-response, high-energy-density localized heating.
Multi-Mode Energy Distribution Platform
Supports flat-top and Gaussian beams, continuous and modulated modes; enables thermal processing and testing across metals, ceramics, composites, and electronic materials.
Product Type
How it works
The system uses a high-power semiconductor laser as the heat source. After optical shaping and focusing, the laser energy precisely targets millimeter-scale areas. The material absorbs the light energy and rapidly converts it into heat, enabling non-contact, localized rapid heating. The device supports two energy distribution modes: Gaussian and top-hat. The Gaussian mode features high energy density at the center with gradual falloff toward the edges, making it ideal for localized melting and peak temperature applications. The top-hat mode delivers uniform energy with sharp edge cutoff, suitable for uniform heating, surface treatment, annealing, and sintering.
The system supports continuous output and modulation control modes, with a power adjustment range of 10–100%. It enables rapid heating, temperature maintenance, and dynamic thermal cycling. The system can integrate thermocouples, infrared pyrometers, or thermal imaging systems for temperature monitoring and closed-loop control, and connects to mechanical motion platforms, material testing equipment, and automated production lines to execute complex temperature programs.
Important Notice:200～1200°C is the stable operating temperature range; peak temperatures can be increased based on material and operating conditions. Actual temperature capacity depends on material absorptivity, spot size, measurement method, and cooling conditions. Final project specifications are subject to agreed test conditions and acceptance criteria.
Core Advantages
Uses a 500 W semiconductor laser, optically shaped and focused to create a millimeter-scale spot heating system. Supports flat-top/Gaussian beam profiles and continuous/modulated modes for fast response and precise local thermal loading.
Precise local heating
Laser non-contact heating concentrates energy on the target area, effectively minimizing thermal impact on surrounding regions to meet micro-zone heat treatment and localized thermal loading requirements.
Fast dynamic response
Laser heat sources offer rapid power adjustment, enabling quick heating, temperature stabilization, and dynamic thermal cycling control.
Flexible Spot Adjustment
Supports spot size configuration from 5 to 20 mm, optimized based on sample dimensions and heat flux requirements.
Multi-Mode Energy Control
Supports continuous output and modulation control for thermal shock, thermal cycling, and complex temperature profile testing.
Multi-energy distribution modes
Supports flat-top and Gaussian beam configurations for uniform heating and localized peak heating processes.
Easy system integration
Integrates with temperature measurement systems, motion platforms, test machines, and automated control systems to achieve closed-loop temperature control.
Key Technical Specifications
| Device Model | KHL-P500 |
| Heating Method | Laser non-contact point heating |
| Laser Power | 500 W |
| Laser wavelength | 915 nm / 976 nm / 980 nm |
| Power adjustment range | 10～100% |
| Spot Size | 5～20 mm (customizable) |
| Spot Type | Uniform distribution / Gaussian distribution |
| Temperature Range | 200～1200°C (stable operation); peak values may increase based on material and operating conditions. |
| Work Mode | Continuous Mode / Modulation Mode |
| Output Interface | QBH (Customizable) |
| Fiber Length | 10 m (customizable) |
| Cooling Method | Air-cooled / Liquid-cooled |
| Power Requirements | AC 220 V ±10% |
| Work Environment | 10～40℃ |
Typical Applications
Localized heat treatment of high-temperature materials
Rapid Heating and Softening Experiment for Metallic Materials
Welding Preheating and Local Heat-Affected Zone Studies
Thermal Cycling and Thermal Fatigue Testing
High-Temperature Performance Testing for Ceramics and Composites
Localized Heating for Semiconductors and Electronic Components
Research on Thermal and Physical Properties of Materials for Scientific Platforms
System Configuration and Control Mode
| Configuration Type | Typical Components | Use Cases |
|---|---|---|
| Basic Power Regulation | Focusing heating head, power controller, cooling assembly, mounting bracket | Process exploration, rapid heating, and experiments with low constant-temperature precision requirements. |
| Closed-loop temperature control | Basic Configuration + Thermocouple or Infrared Temperature Sensor + PID Controller | Target temperature control, heat preservation, over-temperature protection, and repeatability testing |
| Automated Integration Suite | Closed-loop system + 3-axis platform/robotic arm + data acquisition and host computer | Multi-point switching, scan heating, test process linkage, and automatic recording |
Selection Details & Customization Services
Product power, focal length, and control method should be determined jointly based on the sample and test objectives. Before selection, clarify the following information to ensure the spot size, heating rate, and temperature stability meet actual operating conditions:
- Sample material, dimensions, thickness, weight, and surface condition
- Heated zone dimensions, target temperature, allowable ramp-up time, and hold time
- Temperature fluctuation, repeatability, measurement accuracy, and whether temperature curve logging is required
- Fixed-point scanning, multi-position switching, or mobile scanning
- Installation space, working distance, fixture interference, and cooling and safety protection conditions
Available Customizations
- Different power outputs, focal lengths, and target spot sizes
- Fixed, adjustable-angle, or three-axis movable mounting structures
- Thermocouple, Infrared Thermometry, and Dual-Point Verification Solution
- PID closed-loop temperature control, programmable temperature ramping, hold function, and over-temperature protection
- Temperature, Power, and Alarm Data Collection and Export
- Integrate with test machines, robotic arms, fixtures, and automation platforms
Usage and Safety Instructions
- ⚠Strong visible and infrared radiation is emitted during operation. Do not look directly at the light source or focus area. Use appropriate eye and radiation protection equipment.
- ⚠The sample, heating head tip, and surrounding structures may be hot. Install heat guards and allow adequate cooldown time after power-off.
- ⚠Keep the air-cooled channel clear. Do not operate continuously if cooling is abnormal, the reflector surface is contaminated, or electrical connections are loose.
- ⚠Infrared temperature readings are affected by emissivity, angle, and spot size coverage. For highly reflective metals, combine with thermocouples or use a calibrated measurement solution.
- ⚠For adhesives, coatings, and materials that may emit volatiles, evaluate ventilation, smoke extraction, and fire safety conditions.
Product Value
Achieves millimeter-scale non-contact spot heating with precise semiconductor laser focusing. Offers flat-top/Gaussian dual beam modes and continuous/modulated dual operating modes, delivering a high-response precision thermal loading solution for material heat treatment, localized rapid heating, and scientific research.
Energy Distribution Diagram
Figure 3Gaussian Beam Energy Density Profile: Energy density follows a Gaussian distribution from the center outward, with peak intensity at the center gradually tapering toward the edges. The central region reaches high temperatures, making it ideal for localized melting and drilling applications with minimal heat-affected zones.
Figure 4Flat-top laser spot energy density map: Energy is uniformly distributed within the spot with a sharp drop-off at the edges. The uniform energy region is controllable, making it ideal for uniform heating, surface treatment, annealing, sintering, and other applications.
Note: The illustration shows a typical beam energy density distribution; actual distributions may vary slightly due to optical system and measurement conditions.